Research on Heat Dissipation of Split Diamond/Copper Microchannels

FENG Xiaoming; MA Xiang; ZHANG Yonghai; WANG Shuai; LI Bin

doi:10.11728/cjss2025.06.2024-0184

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FENG Xiaoming, MA Xiang, ZHANG Yonghai, WANG Shuai, LI Bin. Research on Heat Dissipation of Split Diamond/Copper Microchannels (in Chinese). Chinese Journal of Space Science, 2025, 45(6): 1-9 doi: 10.11728/cjss2025.06.2024-0184

Citation:

FENG Xiaoming, MA Xiang, ZHANG Yonghai, WANG Shuai, LI Bin. Research on Heat Dissipation of Split Diamond/Copper Microchannels (in Chinese). Chinese Journal of Space Science, 2025, 45(6): 1-9 doi: 10.11728/cjss2025.06.2024-0184

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Research on Heat Dissipation of Split Diamond/Copper Microchannels

doi: 10.11728/cjss2025.06.2024-0184 cstr: 32142.14.cjss.2024-0184

School of Chemical Engineering and Technology, Xi’an Jiaotong University, Xi’an 710049
State Key Laboratory of Multiphase Flow in Power Engineering, Xi’an Jiaotong University, Xi’an 710049

Received Date: 2024-12-13
Rev Recd Date: 2025-02-28

Available Online: 2025-03-11

Abstract

Abstract

With the development of aerospace technology, the intelligence level of spacecraft is increasing day by day. The increasing demand for chip computing power leads to a significant increase in its heat flux density, and the life and reliability of related electronic devices are facing severe heat dissipation challenges. The combination of microchannel heat dissipation technology and high thermal conductivity diamond/copper composites provides an effective way to solve the heat dissipation challenges of spacecraft. In view of the poor machinability of diamond/copper composites, a split diamond/copper composite microchannel heat dissipation system is designed in this paper and compared with a pure copper microchannel system. The heat transfer characteristics of the two microchannel systems at different flow rates (0.3, 0.5, 0.7 m·s^–1) and rib heights (1, 1.5, 2 mm) were investigated using HFE-7100 as the heat transfer medium. When the flow rate is 0.7 m·s^–1, the chip surface temperatures of diamond/copper microchannels at the critical power are lower than those of pure copper microchannels by 12℃, 19℃, and 19.6℃, respectively, with the increase of rib height. The heat transfer coefficients were maximally enhanced by 27.8%, 30.1%, and 28.1% at the three rib heights, respectively, showing the heat dissipation advantages of the diamond/copper composite microchannels. The better heat transfer performance of the diamond/copper composite microchannel system is mainly due to its higher thermal conductivity and surface roughness. The pressure drop between the inlet and outlet of the two microchannel systems is basically the same in the single-phase flow section, and the difference gradually becomes apparent when entering nucleate boiling. At critical power, the pressure drop of the diamond/copper microchannel system is slightly higher than that of the pure copper microchannel system, with a maximum increase of 11.8%. The reason for the higher pressure drop in the diamond/copper microchannel system is that the turbulence level of the working fluid is higher in the diamond/copper microchannel system.
- Diamond/copper composites,
- Microchannels,
- Phase transition heating

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References(28)

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