Volume 45 Issue 2
Apr.  2025
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Article Navigation >  Chinese Journal of Space Science  > 2025  >  45(2): 449-457 Open Access
QIAO Tong, TANG Kai, GUO Yuandong, HUANG Jinyin, LIU Jinlong, HUANG Yilong, MIAO Jianyin, LIN Guiping. Experimental Study of a Manifold Pin-fin Diamond Heat Sink for High Heat Flux Chips (in Chinese). Chinese Journal of Space Science, 2025, 45(2): 449-457 doi: 10.11728/cjss2025.02.2024-0176
Citation: QIAO Tong, TANG Kai, GUO Yuandong, HUANG Jinyin, LIU Jinlong, HUANG Yilong, MIAO Jianyin, LIN Guiping. Experimental Study of a Manifold Pin-fin Diamond Heat Sink for High Heat Flux Chips (in Chinese). Chinese Journal of Space Science, 2025, 45(2): 449-457 doi: 10.11728/cjss2025.02.2024-0176
shu

Experimental Study of a Manifold Pin-fin Diamond Heat Sink for High Heat Flux Chips

doi: 10.11728/cjss2025.02.2024-0176 cstr: 32142.14.cjss.2024-0176
  • 1.

    Laboratory of Fundamental Science on Ergonomics and Environmental Control, School of Aeronautical Science and Engineering, Beihang University, Beijing 100191

  • 2.

    National Key Laboratory of Spacecraft Thermal Control, Beijing Institute of Spacecraft System Engineering, Beijing 100094

  • 3.

    Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083

  • 4.

    Guobo Electronics Co., Ltd., Nanjing 211106

  • 5.

    Hangzhou International Innovation Institute of Beihang University, Hangzhou 311115

  • Received Date: 2024-11-30
  • Accepted Date: 2025-04-07
  • Rev Recd Date: 2025-03-10
    • Available Online: 2025-04-20
    Abstract
  • A manifold pin-fin microchannel diamond heat sink for high heat flux chips was designed and fabricated. Thermal performance of the heat sink in a pump-driven two-phase ammonia loop was investigated using a thermal test chip as a simulated heat source. Chip surface temperature of 102.5℃ with thermal resistance of 0.151 K·W–1 and pressure drop of 1.1 kPa under localized heat flow of 1510 W·cm–2 were obtained. The effects of inlet temperature, heat flux, and mass flow rate on thermal resistance and pressure drop of the heat sink were investigated, and it was found that the thermal resistance of the heat sink was minimized under higher inlet temperature conditions. Keeping all the other operating parameters consistent, the thermal resistance of the diamond manifold pin-fin microchannel radiator was 33.32% smaller and the pressure drop was 23.88% lower under 710 W·cm–2 heat flow conditions when compared with the expanded and contracted manifold microchannel radiator made of copper.

     

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